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Photonics 2015, 2(3), 1005-1026; doi:10.3390/photonics2031005

Hybrid Photonic Integration on a Polymer Platform

1
Fraunhofer Heinrich Hertz Institute (HHI), Einsteinufer 37, Berlin 10587, Germany
2
Photonic Communications Research Laboratory, National Technical University of Athens, Zografou, Athens 15573, Greece
3
III-V Lab, Joint lab between Alcatel-Lucent Bell Labs, Thales-TRT and CEA/Leti, Route de Nozay, Marcoussis 91460, France
4
Linkra Srl, Via S. Martino 7, Agrate Brianza (MB) 20864, Italy
5
GigOptix Inc., 19910 North Creek Parkway Suite 100, Bothell, WA 98011, USA
*
Author to whom correspondence should be addressed.
Received: 13 August 2015 / Revised: 14 September 2015 / Accepted: 15 September 2015 / Published: 21 September 2015
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Abstract

To fulfill the functionality demands from the fast developing optical networks, a hybrid integration approach allows for combining the advantages of various material platforms. We have established a polymer-based hybrid integration platform (polyboard), which provides flexible optical input/ouptut interfaces (I/Os) that allow robust coupling of indium phosphide (InP)-based active components, passive insertion of thin-film-based optical elements, and on-chip attachment of optical fibers. This work reviews the recent progress of our polyboard platform. On the fundamental level, multi-core waveguides and polymer/silicon nitride heterogeneous waveguides have been fabricated, broadening device design possibilities and enabling 3D photonic integration. Furthermore, 40-channel optical line terminals and compact, bi-directional optical network units have been developed as highly functional, low-cost devices for the wavelength division multiplexed passive optical network. On a larger scale, thermo-optic elements, thin-film elements and an InP gain chip have been integrated on the polyboard to realize a colorless, dual-polarization optical 90° hybrid as the frontend of a coherent receiver. For high-end applications, a wavelength tunable 100Gbaud transmitter module has been demonstrated, manifesting the joint contribution from the polyboard technology, high speed polymer electro-optic modulator, InP driver electronics and ceramic electronic interconnects. View Full-Text
Keywords: hybrid photonic integration; photonic integrated circuits; polymer waveguides hybrid photonic integration; photonic integrated circuits; polymer waveguides
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Zhang, Z.; Felipe, D.; Katopodis, V.; Groumas, P.; Kouloumentas, C.; Avramopoulos, H.; Dupuy, J.-Y.; Konczykowska, A.; Dede, A.; Beretta, A.; Vannucci, A.; Cangini, G.; Dinu, R.; Schmidt, D.; Moehrle, M.; Runge, P.; Choi, J.-H.; Bach, H.-G.; Grote, N.; Keil, N.; Schell, M. Hybrid Photonic Integration on a Polymer Platform. Photonics 2015, 2, 1005-1026.

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