Next Article in Journal
Sensitivity Factors Analysis on the Compressive Strength and Flexural Strength of Recycled Aggregate Infill Wall Materials
Previous Article in Journal
Comparative Analysis of Heuristic Algorithms Used for Solving a Production and Maintenance Planning Problem (PMPP)
Previous Article in Special Issue
A Vector Printing Method for High-Speed Electrohydrodynamic (EHD) Jet Printing Based on Encoder Position Sensors
Article Menu

Export Article

Open AccessEditorial
Appl. Sci. 2018, 8(7), 1089; https://doi.org/10.3390/app8071089

Special Issue on Printed Electronics 2017

Department of Mechanical Engineering, Hanyang University, Ansan, Gyeonggi-do 15588, Korea
Received: 8 June 2018 / Accepted: 11 June 2018 / Published: 5 July 2018
(This article belongs to the Special Issue Printed Electronics 2017)
View Full-Text   |   Download PDF [152 KB, uploaded 5 July 2018]
No abstract available View Full-Text
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
SciFeed

Share & Cite This Article

MDPI and ACS Style

Oh, J.H. Special Issue on Printed Electronics 2017. Appl. Sci. 2018, 8, 1089.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Appl. Sci. EISSN 2076-3417 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top