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Journal: Appl. Sci., 2017
Volume: 7
Number: 108

Article: Thermal Sensitive Shape Memory Behavior of Epoxy Composites Reinforced with Silicon Carbide Whiskers
Authors: by Yongkun Wang, Wenchao Tian, Xiaohan Liu and Junjie Ye
Link: https://www.mdpi.com/2076-3417/7/1/108

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