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Appl. Sci. 2017, 7(1), 108; doi:10.3390/app7010108

Thermal Sensitive Shape Memory Behavior of Epoxy Composites Reinforced with Silicon Carbide Whiskers

Key Laboratory of Ministry of Education for Electronic Equipment Structure Design, Xidian University, Xi’an 710071, China
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Academic Editor: Jinlian Hu
Received: 5 December 2016 / Revised: 13 January 2017 / Accepted: 16 January 2017 / Published: 21 January 2017
(This article belongs to the Special Issue Shape Memory Polymers)
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Abstract

A novel shape memory polymer composite was fabricated by introducing various amounts of silicon carbide whiskers (SiCws) into a shape memory epoxy. The relationship between the thermomechanical properties of the system and structural changes were investigated via dynamic mechanical analysis, scanning electron microscopy, and bending tests. The results show that the bend strength of composites can improve by 64.1% when SiCw content reaches 12 wt %. The shape transition temperatures of SiCw/epoxy composites decreased slightly with the increase in SiCw content, but it was noted that all of the composites showed excellent shape memory properties. The shape fixity ratio increased as SiCw content increased (>99%), and the shape recovery ratio slightly decreased as SiCw content increased (>95%). All of the composites nearly recovered to their original shape within 2 min (not 100%), and the shape recovery speed significantly improved at a higher temperature. It is anticipated that tagging products will be used in the aerospace industry. View Full-Text
Keywords: silicon carbide whiskers; hydro-epoxy; mechanical properties; shape memory behavior silicon carbide whiskers; hydro-epoxy; mechanical properties; shape memory behavior
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Wang, Y.; Tian, W.; Liu, X.; Ye, J. Thermal Sensitive Shape Memory Behavior of Epoxy Composites Reinforced with Silicon Carbide Whiskers. Appl. Sci. 2017, 7, 108.

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