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Appl. Sci. 2016, 6(3), 77; doi:10.3390/app6030077

Comparison between Laser and Stamping without Die (SWD) for Micro Tapered Hole Forming

1
Department of Mechanical Engineering, National Yunlin University of Science and Technology, Yunlin 64002, Taiwan
2
Department of Mechanical Engineering, National Taipei University of Technology, Taipei 10608, Taiwan
These authors contributed equally to this work.
*
Author to whom correspondence should be addressed.
Academic Editor: Chien-Hung Liu
Received: 8 December 2015 / Revised: 19 February 2016 / Accepted: 26 February 2016 / Published: 15 March 2016
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Abstract

The forming of a micro tapered hole is based on nanosecond pulsed laser processing, which conforms to fast processing time and high throughput; however, the microhole quality should be improved. Micro stamping is a technology providing high precise size and speed. The greatest difficulty in forming a microhole by micro stamping is the precision alignment of the punch head to the lower die. In order to overcome the difficulty, we proposed a concept of stamping without die (SWD). Without a lower die, the tapered punch head was directly applied to the workpiece for micro stamping, and a thicker workpiece surrounding the punching area provides a better support to the stamping process. Thus, a successful forming of micro tapered holes is completed. The micro tapered hole depth is 300 μm, and the maximum ratio of inlet to outlet diameter is 18:1. In order to reduce the number of experiments, the finite element analysis software DEFORM-3D was used for forming analysis. The simulation forecast result was compared with the experimental processing, which was well validated. Under different experimental parameters of laser energy and defocusing distance, drilling results by two methods show that the microhole quality by stamping process is better than by laser processing. View Full-Text
Keywords: micro stamping; stamping without die; micro tapered hole; DEFORM-3D; laser processing micro stamping; stamping without die; micro tapered hole; DEFORM-3D; laser processing
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Hung, Y.-C.; Chang, Y.-J.; Kuo, C.-L.; Hsu, J.-C.; Ho, C.-C. Comparison between Laser and Stamping without Die (SWD) for Micro Tapered Hole Forming. Appl. Sci. 2016, 6, 77.

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