Abstract: A growing number of applications in science and industry are currently pushing the development of ultrafast laser technologies that enable high average powers. SESAM modelocked thin disk lasers (TDLs) currently achieve higher pulse energies and average powers than any other ultrafast oscillator technology, making them excellent candidates in this goal. Recently, 275 W of average power with a pulse duration of 583 fs were demonstrated, which represents the highest average power so far demonstrated from an ultrafast oscillator. In terms of pulse energy, TDLs reach more than 40 μJ pulses directly from the oscillator. In addition, another major milestone was recently achieved, with the demonstration of a TDL with nearly bandwidth-limited 96-fs long pulses. The progress achieved in terms of pulse duration of such sources enabled the first measurement of the carrier-envelope offset frequency of a modelocked TDL, which is the first key step towards full stabilization of such a source. We will present the key elements that enabled these latest results, as well as an outlook towards the next scaling steps in average power, pulse energy and pulse duration of such sources. These cutting-edge sources will enable exciting new applications, and open the door to further extending the current performance milestones.
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Saraceno, C.J.; Schriber, C.; Emaury, F.; Heckl, O.H.; Baer, C.R.E.; Hoffmann, M.; Beil, K.; Kränkel, C.; Golling, M.; Südmeyer, T.; Keller, U. Cutting-Edge High-Power Ultrafast Thin Disk Oscillators. Appl. Sci. 2013, 3, 355-395.
Saraceno CJ, Schriber C, Emaury F, Heckl OH, Baer CRE, Hoffmann M, Beil K, Kränkel C, Golling M, Südmeyer T, Keller U. Cutting-Edge High-Power Ultrafast Thin Disk Oscillators. Applied Sciences. 2013; 3(2):355-395.
Saraceno, Clara J.; Schriber, Cinia; Emaury, Florian; Heckl, Oliver H.; Baer, Cyrill R.E.; Hoffmann, Martin; Beil, Kolja; Kränkel, Christian; Golling, Matthias; Südmeyer, Thomas; Keller, Ursula. 2013. "Cutting-Edge High-Power Ultrafast Thin Disk Oscillators." Appl. Sci. 3, no. 2: 355-395.