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Metals 2017, 7(6), 189; doi:10.3390/met7060189

Study of Surface Metallization of Polyimide Film and Interfacial Characterization

Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan
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Academic Editor: Håkan Hallberg
Received: 22 March 2017 / Revised: 12 May 2017 / Accepted: 20 May 2017 / Published: 25 May 2017
(This article belongs to the Special Issue Metallization of Non-Conductive Substrates)
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Abstract

Nickel (Ni) metallization of polyimide (PI) was performed using a solution-based process including imide-ring opening reactions, the implanting of Ni ions, the reduction of catalytic Ni nanoparticles, and the electroless deposition of a Ni film. The start-up imide-ring opening reaction plays a crucial role in activating inert PI for subsequent Ni implanting and deposition. A basic treatment of potassium hydroxide (KOH) is commonly used in the imide-ring opening reaction where a poly(amic acid) (PAA) layer forms on the PI surface. In this study, we report that the KOH concentration significantly affects the implanting, reduction, and deposition behavior of Ni. A uniform Ni layer can be grown on a PI film with full coverage through electroless deposition with a KOH concentration of 0.5 M and higher. However, excessive imide-ring opening reactions caused by 5 M KOH treatment resulted in the formation of a thick PAA layer embedded with an uneven distribution of Ni nanoparticles. This composite layer (PAA + Ni) causes wastage of the Ni catalyst and degradation of peel strength of the Ni layer on PI. View Full-Text
Keywords: metallization; Ni; polyimide; interfacial microstructure; nanoparticle metallization; Ni; polyimide; interfacial microstructure; nanoparticle
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Wu, P.-Y.; Lin, C.-H.; Chen, C.-M. Study of Surface Metallization of Polyimide Film and Interfacial Characterization. Metals 2017, 7, 189.

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