Special Issue "Metallization of Non-Conductive Substrates"

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: 31 December 2017

Special Issue Editor

Guest Editor
Prof Dr. Chih-Ming Chen

Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan
Website | E-Mail
Interests: microelectronic solders; microelectronic, optoelectronic, thermoelectric packaging; solar cells; electroplating

Special Issue Information

Dear Colleagues,

This Special Issue aims to highlight recent advancement in the science and technology associated with metallization of non-conductive substrates. Metallization of non-conductive substrates plays an important role in various application fields including microelectronics and optoelectronics. In some specific applications, such as flexible electronics, metallization of polymeric substrates especially attracts more attention. Vacuum-based deposition method can grow a uniform and adhesive metal or alloy film on non-conductive substrates but expensive facilities are always a big concern. Solution-based deposition method is rather simple and cost-effective but an improvement of the film uniformity and adhesion requires more research works. In this special issue, substrates of interests include, but are not limited to, polymer, glass, ceramic, and silicon. Specific topic areas for manuscript submissions include, but are not limited to, methodology of physical and chemical deposition, structures and properties of deposits, new catalysts and deposition methods, metals and alloys deposition, and adhesion and interfacial properties.

Prof. Dr. Chih-Ming Chen
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • deposition
  • adhesion
  • interfacial property
  • microstructure

Published Papers (1 paper)

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Research

Open AccessArticle Study of Surface Metallization of Polyimide Film and Interfacial Characterization
Metals 2017, 7(6), 189; doi:10.3390/met7060189
Received: 22 March 2017 / Revised: 12 May 2017 / Accepted: 20 May 2017 / Published: 25 May 2017
PDF Full-text (23036 KB) | HTML Full-text | XML Full-text
Abstract
Nickel (Ni) metallization of polyimide (PI) was performed using a solution-based process including imide-ring opening reactions, the implanting of Ni ions, the reduction of catalytic Ni nanoparticles, and the electroless deposition of a Ni film. The start-up imide-ring opening reaction plays a crucial
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Nickel (Ni) metallization of polyimide (PI) was performed using a solution-based process including imide-ring opening reactions, the implanting of Ni ions, the reduction of catalytic Ni nanoparticles, and the electroless deposition of a Ni film. The start-up imide-ring opening reaction plays a crucial role in activating inert PI for subsequent Ni implanting and deposition. A basic treatment of potassium hydroxide (KOH) is commonly used in the imide-ring opening reaction where a poly(amic acid) (PAA) layer forms on the PI surface. In this study, we report that the KOH concentration significantly affects the implanting, reduction, and deposition behavior of Ni. A uniform Ni layer can be grown on a PI film with full coverage through electroless deposition with a KOH concentration of 0.5 M and higher. However, excessive imide-ring opening reactions caused by 5 M KOH treatment resulted in the formation of a thick PAA layer embedded with an uneven distribution of Ni nanoparticles. This composite layer (PAA + Ni) causes wastage of the Ni catalyst and degradation of peel strength of the Ni layer on PI. Full article
(This article belongs to the Special Issue Metallization of Non-Conductive Substrates)
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