Special Issue "Metallization of Non-Conductive Substrates"
A special issue of Metals (ISSN 2075-4701).
Deadline for manuscript submissions: closed (31 December 2017)
This Special Issue aims to highlight recent advancement in the science and technology associated with metallization of non-conductive substrates. Metallization of non-conductive substrates plays an important role in various application fields including microelectronics and optoelectronics. In some specific applications, such as flexible electronics, metallization of polymeric substrates especially attracts more attention. Vacuum-based deposition method can grow a uniform and adhesive metal or alloy film on non-conductive substrates but expensive facilities are always a big concern. Solution-based deposition method is rather simple and cost-effective but an improvement of the film uniformity and adhesion requires more research works. In this special issue, substrates of interests include, but are not limited to, polymer, glass, ceramic, and silicon. Specific topic areas for manuscript submissions include, but are not limited to, methodology of physical and chemical deposition, structures and properties of deposits, new catalysts and deposition methods, metals and alloys deposition, and adhesion and interfacial properties.
Prof. Dr. Chih-Ming Chen
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- interfacial property