Technology for 3D System Integration for Flexible Wireless Biomedical Applications
Abstract
:1. Introduction
2. Design
2.1. Theory of Induction Coils
2.2. Dummy Chip Experiment
2.3. 3D Packaging Process Design
3. Fabrication
3.1. Induction Coil Fabrication
3.2. Induction Coil and Chip Integration
- Step a:
- ICP etching
- Step b:
- Parylene coating
- Step c:
- Chip embedding
- Step d:
- First parylene package
- Step e:
- Photoresist patterning
- Step f:
- First parylene etched using RIE
- Step g:
- First gold deposition
- Step h:
- Photoresist patterning
- Step i:
- First gold etching
- Step j:
- Second parylene package
- Step k:
- Photoresist patterning
- Step l:
- Second parylene etched by RIE
- Step m:
- Second gold deposition
- Step n:
- Photoresist patterning
- Step o:
- Second gold etching
- Step p:
- Gold foil pasting
- Step q:
- Third parylene package
- Step r:
- Wafer removal
4. Measurement Setup
5. Results and Discussion
5.1. Patterned Coil
5.2. Wireless Microsystem
6. Conclusions
Author Contributions
Acknowledgments
Conflicts of Interest
References
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Item | Specification |
---|---|
Material | Gold |
Width of strip | 1000 µm |
Outer diameter | 20 mm |
The distance between strips of coil | ~60 µm |
Thickness | 50 µm |
Number of turns | 8.5 |
Item | Inductance (nH) | Resistance (mΩ) | Q-Factor |
---|---|---|---|
Induction coil | 600 | 570.24 | 6.61 |
Induction coil with system | 557 | 819.15 | 4.27 |
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Kuo, W.-C.; Huang, C.-W. Technology for 3D System Integration for Flexible Wireless Biomedical Applications. Micromachines 2018, 9, 213. https://doi.org/10.3390/mi9050213
Kuo W-C, Huang C-W. Technology for 3D System Integration for Flexible Wireless Biomedical Applications. Micromachines. 2018; 9(5):213. https://doi.org/10.3390/mi9050213
Chicago/Turabian StyleKuo, Wen-Cheng, and Chih-Wei Huang. 2018. "Technology for 3D System Integration for Flexible Wireless Biomedical Applications" Micromachines 9, no. 5: 213. https://doi.org/10.3390/mi9050213