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Micromachines 2018, 9(2), 56; doi:10.3390/mi9020056

Continuous Near-Field Electrospraying Using a Glass Capillary Nozzle

School of Mechanical and Automotive Engineering, Xiamen University of Technology, Xiamen 361024, China
Department of Instrumental and Electrical Engineering, Xiamen University, Xiamen 361005, China
Xiamen Key Laboratory of Optoelectronic Transducer Technology, Xiamen 361005, China
Fujian Key Laboratory of Universities and Colleges for Transducer Technology, Xiamen 361005, China
School of Mathematical Sciences, Xiamen University, Xiamen 361005, China
Authors to whom correspondence should be addressed.
Received: 24 December 2017 / Revised: 25 January 2018 / Accepted: 30 January 2018 / Published: 31 January 2018
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A continuous near-field electrospray process has been developed to deposit micropatterns. Different from traditional electrospray technologies, the nozzle-to-substrate distance was shortened to less than 5 mm, and a glass capillary nozzle with a diameter of tens of microns was used. Steady and continuous ejection was achieved, and patterns with line widths of sub-100 μm were generated. The influence of experimental parameters was investigated. The critical voltage for electrospray increased with nozzle-to-substrate distance and flow rate. The line width of electrosprayed patterns increased with the increases in applied voltage, flow rate, nozzle diameter, and deposition time. This work provides a simple and potential route for on-demand deposition of micro-/nano-patterns in the electrospray process. View Full-Text
Keywords: near-field; electrospray; printing; drop-on-demand; jetting near-field; electrospray; printing; drop-on-demand; jetting

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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Wang, X.; Lin, J.; Jiang, J.; Guo, S.; Li, W.; Zheng, G. Continuous Near-Field Electrospraying Using a Glass Capillary Nozzle. Micromachines 2018, 9, 56.

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