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Journal: Materials, 2015
Volume: 8
Number: 5121

Article: Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging
Authors: by Chang-Chun Lee, Tzai-Liang Tzeng and Pei-Chen Huang
Link: https://www.mdpi.com/1996-1944/8/8/5121

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