Materials 2013, 6(8), 3610-3623; doi:10.3390/ma6083610
Article

Fabrication of Super-Hydrophobic Microchannels via Strain-Recovery Deformations of Polystyrene and Oxygen Reactive Ion Etch

Department of Mechanical and Aerospace Engineering, University of Texas, Arlington, TX 76019, USA
* Author to whom correspondence should be addressed.
Received: 26 July 2013; in revised form: 13 August 2013 / Accepted: 14 August 2013 / Published: 19 August 2013
(This article belongs to the Special Issue Smart Polymers and Polymeric Structures)
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Abstract: In this article, we report a simple approach to generate micropillars (whose top portions are covered by sub-micron wrinkles) on the inner surfaces of polystyrene (PS) microchannels, as well as on the top surface of the PS substrate, based on strain-recovery deformations of the PS and oxygen reactive ion etch (ORIE). Using this approach, two types of micropillar-covered microchannels are fabricated. Their widths range from 118 μm to 132 μm, depths vary from 40 μm to 44 μm, and the inclined angles of their sidewalls are from 53° to 64°. The micropillars enable these microchannels to have super-hydrophobic properties. The contact angles observed on the channel-structured surfaces are above 162°, and the tilt angles to make water drops roll off from these channel-structured substrates can be as small as 1°.
Keywords: shape-memory polymer; super-hydrophobic microchannels; hybrid micro/nanostructures

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MDPI and ACS Style

Chakraborty, A.; Xiang, M.; Luo, C. Fabrication of Super-Hydrophobic Microchannels via Strain-Recovery Deformations of Polystyrene and Oxygen Reactive Ion Etch. Materials 2013, 6, 3610-3623.

AMA Style

Chakraborty A, Xiang M, Luo C. Fabrication of Super-Hydrophobic Microchannels via Strain-Recovery Deformations of Polystyrene and Oxygen Reactive Ion Etch. Materials. 2013; 6(8):3610-3623.

Chicago/Turabian Style

Chakraborty, Anirban; Xiang, Mingming; Luo, Cheng. 2013. "Fabrication of Super-Hydrophobic Microchannels via Strain-Recovery Deformations of Polystyrene and Oxygen Reactive Ion Etch." Materials 6, no. 8: 3610-3623.

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