Next Article in Journal
Vanadium Pentoxide-Based Composite Synthesized Using Microwave Water Plasma for Cathode Material in Rechargeable Magnesium Batteries
Previous Article in Journal
Epoxy/Polycaprolactone Systems with Triple-Shape Memory Effect: Electrospun Nanoweb with and without Graphene Versus Co-Continuous Morphology
Materials 2013, 6(10), 4505-4513; doi:10.3390/ma6104505
Article

Mechanical Properties of Cu2O Thin Films by Nanoindentation

* ,
 and
Received: 15 August 2013 / Revised: 29 September 2013 / Accepted: 8 October 2013 / Published: 11 October 2013
Download PDF [445 KB, uploaded 11 October 2013]

Abstract

In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and nanoindentation techniques. The Cu2O thin films are deposited on the glass substrates with the various growth temperatures of 150, 250 and 350 °C by using radio frequency magnetron sputtering. The XRD results show that Cu2O thin films are predominant (111)-oriented, indicating a well ordered microstructure. In addition, the hardness and Young’s modulus of Cu2O thin films are measured by using a Berkovich nanoindenter operated with the continuous contact stiffness measurements (CSM) option. Results indicated that the hardness and Young’s modulus of Cu2O thin films decreased as the growth temperature increased from 150 to 350 °C. Furthermore, the relationship between the hardness and films grain size appears to closely follow the Hall-Petch equation.
Keywords: Cu2O thin film; XRD; AFM; SEM; nanoindentation; hardness Cu2O thin film; XRD; AFM; SEM; nanoindentation; hardness
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Share & Cite This Article

Further Mendeley | CiteULike
Export to BibTeX |
EndNote
MDPI and ACS Style

Jian, S.-R.; Chen, G.-J.; Hsu, W.-M. Mechanical Properties of Cu2O Thin Films by Nanoindentation. Materials 2013, 6, 4505-4513.

View more citation formats

Article Metrics

For more information on the journal, click here

Comments

Cited By

[Return to top]
Materials EISSN 1996-1944 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert