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Materials 2013, 6(10), 4505-4513; doi:10.3390/ma6104505

Mechanical Properties of Cu2O Thin Films by Nanoindentation

Department of Materials Science and Engineering, I-Shou University, Main Campus: No.1, Sec. 1, Syuecheng Rd., Dashu District, Kaohsiung City 84001, Taiwan
Author to whom correspondence should be addressed.
Received: 15 August 2013 / Revised: 29 September 2013 / Accepted: 8 October 2013 / Published: 11 October 2013
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In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and nanoindentation techniques. The Cu2O thin films are deposited on the glass substrates with the various growth temperatures of 150, 250 and 350 °C by using radio frequency magnetron sputtering. The XRD results show that Cu2O thin films are predominant (111)-oriented, indicating a well ordered microstructure. In addition, the hardness and Young’s modulus of Cu2O thin films are measured by using a Berkovich nanoindenter operated with the continuous contact stiffness measurements (CSM) option. Results indicated that the hardness and Young’s modulus of Cu2O thin films decreased as the growth temperature increased from 150 to 350 °C. Furthermore, the relationship between the hardness and films grain size appears to closely follow the Hall-Petch equation.
Keywords: Cu2O thin film; XRD; AFM; SEM; nanoindentation; hardness Cu2O thin film; XRD; AFM; SEM; nanoindentation; hardness
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Jian, S.-R.; Chen, G.-J.; Hsu, W.-M. Mechanical Properties of Cu2O Thin Films by Nanoindentation. Materials 2013, 6, 4505-4513.

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