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Comprehensive Study of Lanthanum Aluminate High-Dielectric-Constant Gate Oxides for Advanced CMOS Devices
Materials 2012, 5(3), 478-500; doi:10.3390/ma5030478

Ultimate Scaling of High-κ Gate Dielectrics: Higher-κ or Interfacial Layer Scavenging?

IBM Thomas J. Watson Research Center, Yorktown Heights, New York, NY 10598, USA
Received: 29 January 2012 / Revised: 11 February 2012 / Accepted: 6 March 2012 / Published: 14 March 2012
(This article belongs to the Special Issue High-k Materials and Devices)
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Current status and challenges of aggressive equivalent-oxide-thickness (EOT) scaling of high-κ gate dielectrics via higher-κ ( > 20) materials and interfacial layer (IL) scavenging techniques are reviewed. La-based higher-κ materials show aggressive EOT scaling (0.5–0.8 nm), but with effective workfunction (EWF) values suitable only for n-type field-effect-transistor (FET). Further exploration for p-type FET-compatible higher-κ materials is needed. Meanwhile, IL scavenging is a promising approach to extend Hf-based high-κ dielectrics to future nodes. Remote IL scavenging techniques enable EOT scaling below 0.5 nm. Mobility-EOT trends in the literature suggest that short-channel performance improvement is attainable with aggressive EOT scaling via IL scavenging or La-silicate formation. However, extreme IL scaling (e.g., zero-IL) is accompanied by loss of EWF control and with severe penalty in reliability. Therefore, highly precise IL thickness control in an ultra-thin IL regime ( < 0.5 nm) will be the key technology to satisfy both performance and reliability requirements for future CMOS devices.
Keywords: high-κ; metal gate; scavenging; higher-κ; EOT; MOSFET high-κ; metal gate; scavenging; higher-κ; EOT; MOSFET
This is an open access article distributed under the Creative Commons Attribution License (CC BY) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Ando, T. Ultimate Scaling of High-κ Gate Dielectrics: Higher-κ or Interfacial Layer Scavenging? Materials 2012, 5, 478-500.

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