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Materials 2017, 10(5), 451; doi:10.3390/ma10050451

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3), Auburn University, Auburn, AL 36849, USA
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Academic Editor: Ming Hu
Received: 28 February 2017 / Revised: 18 April 2017 / Accepted: 18 April 2017 / Published: 26 April 2017
(This article belongs to the Special Issue Thermal Sciences and Thermodynamics of Materials)
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Abstract

This study illustrates test results and comparative literature data on the influence of isothermal aging and thermal cycling associated with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ball grid array (BGA) solder joints finished with ENIG and ENEPIG on the board side and ENIG on the package side compared with ImAg plating on both sides. The resulting degradation data suggests that the main concern for 0.4 mm pitch 10 mm package size BGA is package side surface finish, not board side. That is, ENIG performs better than immersion Ag for applications involving long-term isothermal aging. SAC305, with a higher relative fraction of Ag3Sn IMC within the solder, performs better than SAC105. SEM and polarized light microscope analysis show cracks propagated from the corners to the center or even to solder bulk, which eventually causes fatigue failure. Three factors are discussed: IMC, grain structure, and Ag3Sn particle. The continuous growth of Cu-Sn intermetallic compounds (IMC) and grains increase the risk of failure, while Ag3Sn particles seem helpful in blocking the crack propagation. View Full-Text
Keywords: thermal cycling; surface finishes; SAC; ENIG; ENIPIG; intermetallic; Ag3Sn; crack propagation thermal cycling; surface finishes; SAC; ENIG; ENIPIG; intermetallic; Ag3Sn; crack propagation
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Shen, C.; Hai, Z.; Zhao, C.; Zhang, J.; Evans, J.L.; Bozack, M.J.; Suhling, J.C. Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling. Materials 2017, 10, 451.

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