Abstract: The subject of this study was the development of flavour alginate formulationsaimed for thermally processed foods. Ethyl vanilline was used as the model flavourcompound. Electrostatic extrusion was applied for the encapsulation of ethyl vanilline inalginate gel microbeads. The obtained microbeads with approx. 10 % w/w of ethylvanilline encapsulated in about 2 % w/w alginate were uniformly sized spheres of about450 μm. Chemical characterization by H-NMR spectroscopy revealed that the alginateused in this study had a high content (67 %) of guluronic residues and was rich in GG diadblocks (FGG = 55%) and thus presented a high-quality immobilisation matrix. The thermalbehaviour of alginate beads encapsulating ethyl vanilline was investigated bythermogravimetric (TG) and differential scanning calorimetry measurements (TG-DSC)under heating conditions which mimicked usual food processing to provide informationabout thermal decomposition of alginate matrix and kinetics of aroma release. Two wellresolved weight losses were observed. The first one was in the 50-150 °C temperaturerange with the maximum at approx. 112 °C, corresponding to the dehydration of thepolymer network. The second loss in the 220-325 °C temperature range, with a maximumat ~ 247 °C corresponded to the release of vanilline. The obtained results indicate that up to230 °C most of the vanilline remained intacta, while prolonged heating at elevatedtemperatures led to the entire loss of the aroma compound.
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Manojlovic, V.; Rajic, N.; Djonlagic, J.; Obradovic, B.; Nedovic, V.; Bugarski, B. Application of Electrostatic Extrusion – Flavour Encapsulation and Controlled Release. Sensors 2008, 8, 1488-1496.
Manojlovic V, Rajic N, Djonlagic J, Obradovic B, Nedovic V, Bugarski B. Application of Electrostatic Extrusion – Flavour Encapsulation and Controlled Release. Sensors. 2008; 8(3):1488-1496.
Manojlovic, Verica; Rajic, Nevenka; Djonlagic, Jasna; Obradovic, Bojana; Nedovic, Viktor; Bugarski, Branko. 2008. "Application of Electrostatic Extrusion – Flavour Encapsulation and Controlled Release." Sensors 8, no. 3: 1488-1496.