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Sensors 2017, 17(6), 1392; doi:10.3390/s17061392

Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis

1
Department of Mechanical Engineering, National Cheng Kung University, No. 1, University Road, Tainan 701, Taiwan
2
Department of Engineering Science, National Cheng Kung University, No. 1, University Road, Tainan 701, Taiwan
*
Author to whom correspondence should be addressed.
Received: 4 May 2017 / Revised: 12 June 2017 / Accepted: 13 June 2017 / Published: 15 June 2017
(This article belongs to the Special Issue Innovative Sensing Control Scheme for Advanced Materials)

Abstract

Although wafer-level camera lenses are a very promising technology, problems such as warpage with time and non-uniform thickness of products still exist. In this study, finite element simulation was performed to simulate the compression molding process for acquiring the pressure distribution on the product on completion of the process and predicting the deformation with respect to the pressure distribution. Results show that the single-gate compression molding process significantly increases the pressure at the center of the product, whereas the multi-gate compressing molding process can effectively distribute the pressure. This study evaluated the non-uniform thickness of product and changes in the process parameters through computer simulations, which could help to improve the compression molding process. View Full-Text
Keywords: wafer level lens; finite element method (FEM); compression molding wafer level lens; finite element method (FEM); compression molding
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Wu, K.-T.; Hwang, S.-J.; Lee, H.-H. Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis. Sensors 2017, 17, 1392.

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