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Sensors 2017, 17(10), 2250; doi:10.3390/s17102250

Experimental and Numerical Investigations in Shallow Cut Grinding by Workpiece Integrated Infrared Thermopile Array

Institute for Microsensors, -Actuators and -Systems (IMSAS), Microsystems Center Bremen (MCB), University of Bremen, 28359 Bremen, Germany
Current address: Otto-Hahn-Allee 1, 28359 Bremen, Germany.
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Received: 30 August 2017 / Revised: 12 September 2017 / Accepted: 21 September 2017 / Published: 30 September 2017
(This article belongs to the Section Physical Sensors)
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Abstract

The purpose of our study is to investigate the heat distribution and the occurring temperatures during grinding. Therefore, we did both experimental and numerical investigations. In the first part, we present the integration of an infrared thermopile array in a steel workpiece. Experiments are done by acquiring data from the thermopile array during grinding of a groove in a workpiece made of steel. In the second part, we present numerical investigations in the grinding process to further understand the thermal characteristic during grinding. Finally, we conclude our work. Increasing the feed speed leads to two things: higher heat flux densities in the workpiece and higher temperature gradients in the material. View Full-Text
Keywords: IR measurement; grinding characterization; sensor integration IR measurement; grinding characterization; sensor integration
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Reimers, M.; Lang, W.; Dumstorff, G. Experimental and Numerical Investigations in Shallow Cut Grinding by Workpiece Integrated Infrared Thermopile Array. Sensors 2017, 17, 2250.

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