Next Article in Journal
Giant Magnetoresistance: Basic Concepts, Microstructure, Magnetic Interactions and Applications
Next Article in Special Issue
A Smart Spoofing Face Detector by Display Features Analysis
Previous Article in Journal
Radar Constant-Modulus Waveform Design with Prior Information of the Extended Target and Clutter
Previous Article in Special Issue
Novel Wearable Device for Blood Leakage Detection during Hemodialysis Using an Array Sensing Patch
Article Menu

Export Article

Open AccessArticle
Sensors 2016, 16(6), 902; doi:10.3390/s16060902

Mechanical Strength and Broadband Transparency Improvement of Glass Wafers via Surface Nanostructures

1
Institute of Nanoengineering and Microsystems, National Tsing Hua University, No. 101, Section 2, Kuang-Fu Road, Hsinchu 30013, Taiwan
2
Department of Mechanical Engineering, National United University, No.2, Lienda, Miaoli 36063, Taiwan
3
Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang-Fu Road, Hsinchu 30013, Taiwan
4
Instrument Technology Research Center, National Applied Research Laboratories, 20, R&D Road VI, Hsinchu Science Park, Hsinchu 30076, Taiwan
*
Author to whom correspondence should be addressed.
Academic Editor: Teen-Hang Meen
Received: 5 May 2016 / Revised: 9 June 2016 / Accepted: 13 June 2016 / Published: 17 June 2016
View Full-Text   |   Download PDF [2293 KB, uploaded 17 June 2016]   |  

Abstract

In this study, we mechanically strengthened a borosilicate glass wafer by doubling its bending strength and simultaneously enhancing its transparency using surface nanostructures for different applications including sensors, displays and panels. A fabrication method that combines dry and wet etching is used for surface nanostructure fabrication. Specifically, we improved the bending strength of plain borosilicate glass by 96% using these surface nanostructures on both sides. Besides bending strength improvement, a limited optical transmittance enhancement of 3% was also observed in the visible light wavelength region (400–800 nm). Both strength and transparency were improved by using surface nanostructures of 500 nm depth on both sides of the borosilicate glass without affecting its bulk properties or the glass manufacturing process. Moreover, we observed comparatively smaller fragments during the breaking of the nanostructured glass, which is indicative of strengthening. The range for the nanostructure depth is defined for different applications with which improvements of the strength and transparency of borosilicate glass substrate are obtained. View Full-Text
Keywords: surface nanostructure; bending strength; transparency; borosilicate glass surface nanostructure; bending strength; transparency; borosilicate glass
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Scifeed alert for new publications

Never miss any articles matching your research from any publisher
  • Get alerts for new papers matching your research
  • Find out the new papers from selected authors
  • Updated daily for 49'000+ journals and 6000+ publishers
  • Define your Scifeed now

SciFeed Share & Cite This Article

MDPI and ACS Style

Kumar, A.; Kashyap, K.; Hou, M.T.; Yeh, J.A. Mechanical Strength and Broadband Transparency Improvement of Glass Wafers via Surface Nanostructures. Sensors 2016, 16, 902.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top