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Sensors 2016, 16(11), 1608; doi:10.3390/s16111608

An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications

1
Institute of Avionics and Aeronautics, Air University, E-9, Islamabad 44000, Pakistan
2
Department of Engineering, University of Cambridge, 9-JJ Thomson Avenue, Cambridge CB3 0FA, UK
3
National University of Sciences & Technology (NUST), H-12, Islamabad 44000, Pakistan
4
Pakistan Institute of Engineering and Applied Sciences, Nilore, Islamabad 45650, Pakistan
5
Cambridge CMOS Sensors Ltd., Deanland House, 160-Cowley Road, Cambridge CB4 0DL, UK
This paper is an extended version of our published paper “SOI CMOS multi-sensors MEMS chip for aerospace applications”. In Proceedings of the 13th IEEE Conference on Sensors, Valencia, Spain, 2–5 November 2014.
*
Author to whom correspondence should be addressed.
Academic Editor: Remco Wiegerink
Received: 4 June 2016 / Revised: 1 September 2016 / Accepted: 2 September 2016 / Published: 4 November 2016
(This article belongs to the Special Issue Microfluidic Sensors and Control Devices)
View Full-Text   |   Download PDF [5378 KB, uploaded 4 November 2016]   |  

Abstract

An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA–0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C–1.79 mV/°C in the range 20–300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(Vexcit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min)−0.1 in the tested range of 0–4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries. View Full-Text
Keywords: SOI; CMOS; MEMS; aerospace; fluid dynamics; dense sensor packing; thermodiodes; DRIE; multi-sensor; sensor system; thermal flow rate sensor; piezoresistive pressure sensor SOI; CMOS; MEMS; aerospace; fluid dynamics; dense sensor packing; thermodiodes; DRIE; multi-sensor; sensor system; thermal flow rate sensor; piezoresistive pressure sensor
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Mansoor, M.; Haneef, I.; Akhtar, S.; Rafiq, M.A.; De Luca, A.; Ali, S.Z.; Udrea, F. An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications. Sensors 2016, 16, 1608.

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