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Sensors 2015, 15(9), 23459-23476; doi:10.3390/s150923459

Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors

Department of Bioengineering, University of California San Diego, La Jolla, CA 92093, USA
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Author to whom correspondence should be addressed.
Academic Editor: Oliver Amft
Received: 23 July 2015 / Revised: 5 September 2015 / Accepted: 10 September 2015 / Published: 16 September 2015
(This article belongs to the Special Issue Wearable Sensors)
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Abstract

New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizing the fabrication procedures for these devices so that large-scale industrial translation is realistic. This article presents an unconventional approach for facile microfabrication and processing of adhesive-peeled (AP) flexible sensors. By assembling AP sensors on a weakly-adhering substrate in an inverted fashion, we demonstrate a procedure with 50% reduced end-to-end processing time that achieves greater levels of fabrication yield. The methodology is used to demonstrate the fabrication of electrical and mechanical flexible and stretchable AP sensors that are peeled-off their carrier substrates by consumer adhesives. In using this approach, we outline the manner by which adhesion is maintained and buckling is reduced for gold film processing on polydimethylsiloxane substrates. In addition, we demonstrate the compatibility of our methodology with large-scale post-processing using a roll-to-roll approach. View Full-Text
Keywords: flexible electronics; roll-to-roll; peel-off; flexible sensors flexible electronics; roll-to-roll; peel-off; flexible sensors
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Kang, D.Y.; Kim, Y.-S.; Ornelas, G.; Sinha, M.; Naidu, K.; Coleman, T.P. Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors. Sensors 2015, 15, 23459-23476.

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