Next Article in Journal
Energy-Efficient Crowdsensing of Human Mobility and Signal Levels in Cellular Networks
Previous Article in Journal
Inspection of Pole-Like Structures Using a Visual-Inertial Aided VTOL Platform with Shared Autonomy
Article Menu

Export Article

Open AccessArticle
Sensors 2015, 15(9), 22049-22059; doi:10.3390/s150922049

Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer

1
Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China
2
School of Automation, Southeast University, Nanjing 210096, China
3
Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan
*
Author to whom correspondence should be addressed.
Academic Editor: Vittorio M. N. Passaro
Received: 28 May 2015 / Revised: 23 August 2015 / Accepted: 26 August 2015 / Published: 2 September 2015
(This article belongs to the Section Physical Sensors)
View Full-Text   |   Download PDF [2203 KB, uploaded 2 September 2015]   |  

Abstract

In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm2 chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved. View Full-Text
Keywords: quartz MEMS; vibrating beam accelerometer; flip chip bonding; self-alignment; double ended tuning fork quartz MEMS; vibrating beam accelerometer; flip chip bonding; self-alignment; double ended tuning fork
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Scifeed alert for new publications

Never miss any articles matching your research from any publisher
  • Get alerts for new papers matching your research
  • Find out the new papers from selected authors
  • Updated daily for 49'000+ journals and 6000+ publishers
  • Define your Scifeed now

SciFeed Share & Cite This Article

MDPI and ACS Style

Liang, J.; Zhang, L.; Wang, L.; Dong, Y.; Ueda, T. Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer. Sensors 2015, 15, 22049-22059.

Show more citation formats Show less citations formats

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top