Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer
AbstractIn this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm2 chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved. View Full-Text
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Liang, J.; Zhang, L.; Wang, L.; Dong, Y.; Ueda, T. Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer. Sensors 2015, 15, 22049-22059.
Liang J, Zhang L, Wang L, Dong Y, Ueda T. Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer. Sensors. 2015; 15(9):22049-22059.Chicago/Turabian Style
Liang, Jinxing; Zhang, Liyuan; Wang, Ling; Dong, Yuan; Ueda, Toshitsugu. 2015. "Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer." Sensors 15, no. 9: 22049-22059.