Next Article in Journal
A Comprehensive Study on Technologies of Tyre Monitoring Systems and Possible Energy Solutions
Next Article in Special Issue
Synchronous Motor with Hybrid Permanent Magnets on the Rotor
Previous Article in Journal
Innovative Pressure Sensor Platform and Its Integration with an End-User Application
Previous Article in Special Issue
Characteristics Verification of an Independently Controllable Electromagnetic Spherical Motor
Sensors 2014, 14(6), 10292-10305; doi:10.3390/s140610292
Article

The Design, Fabrication and Characterization of a Transparent Atom Chip

1,* , 1
, 2
, 3
 and 2
Received: 29 April 2014; in revised form: 3 June 2014 / Accepted: 10 June 2014 / Published: 11 June 2014
View Full-Text   |   Download PDF [401 KB, uploaded 21 June 2014]   |   Browse Figures
Abstract: This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm) without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments.
Keywords: glass substrate; transparent atom chip; heat dissipation glass substrate; transparent atom chip; heat dissipation
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Export to BibTeX |
EndNote


MDPI and ACS Style

Chuang, H.-C.; Huang, C.-S.; Chen, H.-P.; Huang, C.-S.; Lin, Y.-H. The Design, Fabrication and Characterization of a Transparent Atom Chip. Sensors 2014, 14, 10292-10305.

AMA Style

Chuang H-C, Huang C-S, Chen H-P, Huang C-S, Lin Y-H. The Design, Fabrication and Characterization of a Transparent Atom Chip. Sensors. 2014; 14(6):10292-10305.

Chicago/Turabian Style

Chuang, Ho-Chiao; Huang, Chia-Shiuan; Chen, Hung-Pin; Huang, Chi-Sheng; Lin, Yu-Hsin. 2014. "The Design, Fabrication and Characterization of a Transparent Atom Chip." Sensors 14, no. 6: 10292-10305.


Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert