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Sensors 2012, 12(9), 12572-12587; doi:10.3390/s120912572
Article
Modular Architecture of a Non-Contact Pinch Actuation Micropump
Pei Song Chee 1 
, Rashidah Arsat 1 , Tijjani Adam 2 , Uda Hashim 2 , Ruzairi Abdul Rahim 1 and Pei Ling Leow 1,*
, Rashidah Arsat 1 , Tijjani Adam 2 , Uda Hashim 2 , Ruzairi Abdul Rahim 1 and Pei Ling Leow 1,*
1
Faculty of Electrical Engineering, Universiti Teknologi Malaysia (UTM), 81310 Johor Bahru, Johor, Malaysia
2
Institute of Nanoelectronic Engineering, Universiti Malaysia Perlis (UniMAP), 01000 Kangar, Perlis, Malaysia
* Author to whom correspondence should be addressed.
Received: 13 July 2012; in revised form: 18 August 2012 / Accepted: 28 August 2012 / Published: 13 September 2012
(This article belongs to the Special Issue Microfluidic Devices)
Download PDF Full-Text [1252 KB, uploaded 13 September 2012 14:03 CEST]
Abstract: This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0–5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0–80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz.
Keywords: electromagnetic micropump; diffuser; lab on chip; hot embossing
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MDPI and ACS Style
Chee, P.S.; Arsat, R.; Adam, T.; Hashim, U.; Rahim, R.A.; Leow, P.L. Modular Architecture of a Non-Contact Pinch Actuation Micropump. Sensors 2012, 12, 12572-12587.
AMA StyleChee PS, Arsat R, Adam T, Hashim U, Rahim RA, Leow PL. Modular Architecture of a Non-Contact Pinch Actuation Micropump. Sensors. 2012; 12(9):12572-12587.
Chicago/Turabian StyleChee, Pei Song; Arsat, Rashidah; Adam, Tijjani; Hashim, Uda; Rahim, Ruzairi Abdul; Leow, Pei Ling. 2012. "Modular Architecture of a Non-Contact Pinch Actuation Micropump." Sensors 12, no. 9: 12572-12587.