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Sensors 2012, 12(9), 11592-11600; doi:10.3390/s120911592

A Fully Integrated Humidity Sensor System-on-Chip Fabricated by Micro-Stamping Technology

Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 10617, Taiwan
Author to whom correspondence should be addressed.
Received: 27 July 2012 / Revised: 17 August 2012 / Accepted: 24 August 2012 / Published: 27 August 2012
(This article belongs to the Special Issue Ultra-Small Sensor Systems and Components)
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A fully integrated humidity sensor chip was designed, implemented, and tested. Utilizing the micro-stamping technology, the pseudo-3D sensor system-on-chip (SSoC) architecture can be implemented by stacking sensing materials directly on the top of a CMOS-fabricated chip. The fabricated sensor system-on-chip (2.28 mm × 2.48 mm) integrated a humidity sensor, an interface circuit, a digital controller, and an On-Off Keying (OOK) wireless transceiver. With low power consumption, i.e., 750 μW without RF operation, the sensitivity of developed sensor chip was experimentally verified in the relative humidity (RH) range from 32% to 60%. The response time of the chip was also experimentally verified to be within 5 seconds from RH 36% to RH 64%. As a consequence, the implemented humidity SSoC paves the way toward the an ultra-small sensor system for various applications. View Full-Text
Keywords: humidity sensor chip; sensor system-on-chip; polyaniline; micro-stamping process humidity sensor chip; sensor system-on-chip; polyaniline; micro-stamping process

This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Huang, C.-W.; Huang, Y.-J.; Lu, S.-S.; Lin, C.-T. A Fully Integrated Humidity Sensor System-on-Chip Fabricated by Micro-Stamping Technology. Sensors 2012, 12, 11592-11600.

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