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Development of a Three Dimensional Neural Sensing Device by a Stacking Method
Department of Electrical Engineering, National Chiao Tung University, No. 1001, University Road, Hsinchu City 30010, Taiwan
School of Medical, China Medical University, No.91, Hsueh-Shih Road, Taichung, Taiwan
* Author to whom correspondence should be addressed.
Received: 16 March 2010; in revised form: 16 April 2010 / Accepted: 19 April 2010 / Published: 28 April 2010
Abstract: This study reports a new stacking method for assembling a 3-D microprobe array. To date, 3-D array structures have usually been assembled with vertical spacers, snap fasteners and a supporting platform. Such methods have achieved 3-D structures but suffer from complex assembly steps, vertical interconnection for 3-D signal transmission, low structure strength and large implantable opening. By applying the proposed stacking method, the previous techniques could be replaced by 2-D wire bonding. In this way, supporting platforms with slots and vertical spacers were no longer needed. Furthermore, ASIC chips can be substituted for the spacers in the stacked arrays to achieve system integration, design flexibility and volume usage efficiency. To avoid overflow of the adhesive fluid during assembly, an anti-overflow design which made use of capillary action force was applied in the stacking method as well. Moreover, presented stacking procedure consumes only 35 minutes in average for a 4 × 4 3-D microprobe array without requiring other specially made assembly tools. To summarize, the advantages of the proposed stacking method for 3-D array assembly include simplified assembly process, high structure strength, smaller opening area and integration ability with active circuits. This stacking assembly technique allows an alternative method to create 3-D structures from planar components.
Keywords: microassembly; microprobe array; three dimensional probe array
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Cite This Article
MDPI and ACS Style
Chang, C.-W.; Chiou, J.-C. Development of a Three Dimensional Neural Sensing Device by a Stacking Method. Sensors 2010, 10, 4238-4252.
Chang C-W, Chiou J-C. Development of a Three Dimensional Neural Sensing Device by a Stacking Method. Sensors. 2010; 10(5):4238-4252.
Chang, Chih-Wei; Chiou, Jin-Chern. 2010. "Development of a Three Dimensional Neural Sensing Device by a Stacking Method." Sensors 10, no. 5: 4238-4252.