Reprint
Simulation and Reliability Assessment of Advanced Packaging
Edited by
April 2024
296 pages
- ISBN 978-3-7258-0972-1 (Hardback)
- ISBN 978-3-7258-0971-4 (PDF)
This is a Reprint of the Special Issue Simulation and Reliability Assessment of Advanced Packaging that was published in
Engineering
Summary
Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.