Imaging: Sensors and Technologies

Edited by
February 2017
632 pages
  • ISBN978-3-03842-360-7 (Paperback)
  • ISBN978-3-03842-361-4 (PDF)

This book is a reprint of the Special Issue Imaging: Sensors and Technologies that was published in

Chemistry & Materials Science
Environmental & Earth Sciences
  • Paperback
© 2017 MDPI; under CC BY-NC-ND license
monocular-vision sensor; vision measurement; flying height detecting; MAVs; hovering; banknote recognition; one-dimensional (line) sensor; pre-classification; USD banknote; nonintrusive finger-vein capturing device using NIR image sensor; misalignment of finger-vein image; multiple images for enrollment; score-level fusion; stereo matching; depth sensor; multiscale pseudo-two-layer model; segmentation; texture constraint; fusion move; synchronous fluorescence; ultrafast; time-resolved; imaging; cancer diagnosis; obstacle detection; Kinect; depth map; travel aid; three-dimensional sensing; arrays; three-dimensional image acquisition; optical sensing and sensors; thin film devices and applications; three-dimensional image processing; video stitching; video surveillance; layered warping; parallax; successive approximation register ADC; column parallel readout; CMOS image sensor; capacitive micro-machined ultrasonic transducer linear array; transmission performance; synthetic aperture focusing technique; underwater imaging; fingerprint localization; optical camera; image processing; orientation sensor; crowd-sourcing; smartphone; penetration depth; hyperspectral imaging; milk powder; PLS-DA; UAV; object detection; object recognition; SVM; manipulation; color restoration; infrared cut-off filter removal; multispectral imaging; spectral estimation; spectral decomposition; semiconductor detector; CZT; defective points; calibration; wobbling method; occlusion detection; automatic camera calibration; depth estimation; moving object detection; video surveillance system; CMOS image sensor (CIS); gated imager; snapshot imager; ultra-fast global shutter; framing camera; low parasitic light sensitivity; high shutter efficiency; vision application; outdoor imaging; visual sensing; flood detection; flexible electronics; flexible displays; flexible X-ray detectors; amorphous silicon PIN diodes; passivation; hand-tracking system; Kinect sensor; 3D reconstruction; blind people; multi-camera vision; bevel gear; defect detection; dimension measurement; faint meteor shower; meteoroid; CCD camera; image intensifier; image processing; time sequential thermography; micrometeorology; self-organizing maps; surface energy balance; turbulence; microclimate; infrared camera; CMOS TDI image sensor; accumulation technique; coarse quantization; fine quantization; delay step; delay range; time jitter; Delay-Locked Loop (DLL); charge pump; Capacitor-Reset Circuit (CRC); UV camera; UV imaging; smartphone sensor technology; sulphur dioxide emissions; Raspberry Pi; low-cost camera; MEMS array; scalable system; multi-platform framework; acoustic imaging; depth imaging; modulated acquisition; structured light; triangulation; probabilistic graphical models; 3D reconstruction; Kompsat-3A; AEISS-A; calibration; validation; optical surface profilometry; interference; phase modulation; liquid crystal; dynamic fringe pattern generator; driver distraction detection; visual-based sensors; image processing; CMOS image sensor; event-based vision; high-speed visual acquisition; data-flow architecture; FPGA system; laser scanning; OCT; wavelength swept laser; full-field OCT; large area scanning; galvo filter; RGB-D sensor; RealSense; visually impaired people; traversable area detection; wavefront coding; extended depth of field; iris recognition; biometrics; infrared sensor; multispectral; diurnal cycle; thermal crossover; ToF camera; depth error; error modeling; error correction; particle filter; SVM; sporadic meteor; real-time detection; image intensifier; meteor automatic imager and analyzer; graphical processing unit