Reprint

Electrochemical Deposition: Properties and Applications

Edited by
February 2024
164 pages
  • ISBN978-3-7258-0193-0 (Hardback)
  • ISBN978-3-7258-0194-7 (PDF)

This book is a reprint of the Special Issue Electrochemical Deposition: Properties and Applications that was published in

Chemistry & Materials Science
Engineering
Summary

The Special Issue contains topical papers on the latest research, development, and application of electrochemical deposition method. The method is based on the chemical reduction of metal ions or their complexes. It is an almost universal way of making material coatings on the surface of conductive substrates by electrolysis of aqueous solutions containing metal ions or complexes. Electrochemical deposition is an inexpensive and relatively fast method that can be applied on an industrial scale for nano- and micro-structured coatings over a large area.With deep respect, we dedicate this Special Issue to the memory of the distinguished scientist Assoc. Prof. Dr. Konstantin Lovchinov (Bulgarian Academy of Sciences), who was its initiator and the main Guest Editor.

Format
  • Hardback
License
© 2022 by the authors; CC BY-NC-ND license
Keywords
electrochemical deposition; surface morphology; ZrO2 films; optical measurement; pulsed electrodeposition; nanotubes; nanodots; porous template; varicap device; site-selective deposition; delafossite CuFeO2 film; galvanostatic electrodeposition; deposition parameters; morphological characteristic; compositional characteristic; chemical vapor deposition (CVD); ceramic composite coatings; layer conditions; deposition mechanism; reaction kinetics; electrodeposition; Fe-W-P alloy; hydrogen evolution; pH; soft magnetic; electrophoretic deposition; solid oxide fuel cell; thin-film electrolyte coating; MIEC electrolyte; barrier layer; doped Bi2O3; soot; circle economy; waste treatment; super capacitors; organic synthesis; photovoltaics; multinary chalcogenides; thermal annealing; Kesterite; XRD; electroless Ni-P; electroless deposition; microhardness; annealing; plating parameters; electromagnetic interruption; DC sputtering; titanium; conducting polymers; PEDOT; counterions; electroanalysis