Reprint

Fusion Bonding/Welding of Polymer Composites

Edited by
January 2024
176 pages
  • ISBN978-3-0365-9963-2 (Hardback)
  • ISBN978-3-0365-9964-9 (PDF)

This book is a reprint of the Special Issue Fusion Bonding/Welding of Polymer Composites that was published in

Chemistry & Materials Science
Engineering
Physical Sciences
Summary

This Special Issue reprint focuses on the latest advances and development of fusion bonding/welding of polymer composites. It contains research articles addressing materials, processing, modeling, monitoring, or performance issues with experimental or numerical approaches. Whatever the process, e.g., resistance, induction, ultrasonic, laser or conduction welding, or 3D printing using fused deposition modeling, one of the challenges is to master the interfacial phenomena, structure, and quality in the assembly area (welds), which is rather tricky due to the presence of the reinforcement fibers. Additionally, it is of paramount importance to develop reliable predictive process simulation software and monitor and control the process parameters in situ.

Format
  • Hardback
License
© 2022 by the authors; CC BY-NC-ND license
Keywords
joining; process modelling and simulation; sandwich structures; numerical analysis; ultrasonic technology; polymer composites; fusion bonding; heat transfer; high-frequency welding; joining; CF/PPS; energy director; additive manufacturing; radiative transfer; large scale; IR measurement; phenoxy; welding technology; interphase; ultrasonic welding; weld properties; advanced composites; epoxy vitrimer; surface depolymerization; welding; bond exchange reactions; thermoplastics; composites; laser welding; induction welding; ultrasonic welding; fusion bounding; Elium®; reactive welding; molecular interdiffusion; laser transmission welding; 3D printing; composite materials; thermoplastic polymers; interface temperature; modeling; simulation; fusion bonding; ultrasonic welding; thermoplastic composites; adherend thickness; hammering effect; co-curing bonding; plasma treatment; PEEK/epoxy interphase