Reprint

Robust Microelectronic Devices

Edited by
March 2022
130 pages
  • ISBN978-3-0365-3337-7 (Hardback)
  • ISBN978-3-0365-3338-4 (PDF)

This book is a reprint of the Special Issue Robust Microelectronic Devices that was published in

Chemistry & Materials Science
Engineering
Environmental & Earth Sciences
Summary

Integrated electronic circuits have influenced our society over the past decades and have become an indispensable part of our daily lives. To maintain this development and ensure benefits for decades to come, continuous further development of electronic chips is necessary. These developments include improving their performance and universality and exploiting the full potential of microelectronic technologies. An important issue for all microelectronic devices is their robustness, i.e., the high performant and reliable function, which is the key for long-term failure safe and stable operation of complex electrical circuits and applications. In real devices, the high-performant and stable operation becomes limited by various physical effects, such as bias temperature instabilities, stress-induced leakage currents, etc. A continuous improvement of the physical understanding of such effects is essential for further optimization of silicon transistors and the improvement of the performance of emerging technologies such as devices based on wide bandgap materials like SiC or GaN as well as for novel 2D transistors. The publications published in this special issue cover various aspects of robust electronic devices and are just as diverse as the field of research itself.

Format
  • Hardback
License
© 2022 by the authors; CC BY-NC-ND license
Keywords
hysteresis; device parameters; reproducibility; device characteristics; silicon carbide; threshold voltage; current-voltage characteristics; IV-curve; preconditioning; GaN transistors; MIS/MOS; MISHEMT; MISFET; PBTI; NBTI; threshold voltage instability; interface traps; oxide traps; carbon paste; n-type Ge; Schottky diodes; interlayer; ammonothermal; crystal growth; numerical simulation; gallium nitride; computational fluid dynamics; conjugated heat transfer; natural convection; buoyancy; solvothermal; hydrothermal; selenides; seebeck coefficient; lead-free thermoelectric materials; metamaterial polarization converter/absorber; switcher; photoconductive silicon; THz wave; orthogonal double split-ring resonator; circuit reliability; pseudo-CMOS inverter circuits; SiC power MOSFETs; bias temperature instabilities; defect modeling; spice simulation; n/a