PCB Tests during Assembly and Splitting†
AbstractThe flexure inspection of printed circuit boards during assembly and operation is the object of the article. The goal is to identify high stresses which can lead to destruct especially the soldered connections during final product operation using strain gauge technique. This is demonstrated on some examples. It is shown how important is the proper wires installation leading from strain gauges to measurement unit. The tests are performed according IPC guidelines but some remarks are given to guidelines specification.
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Chvojan, J. PCB Tests during Assembly and Splitting. Proceedings 2018, 2, 472.
Chvojan J. PCB Tests during Assembly and Splitting. Proceedings. 2018; 2(8):472.Chicago/Turabian Style
Chvojan, Jan. 2018. "PCB Tests during Assembly and Splitting." Proceedings 2, no. 8: 472.
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