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Proceedings 2018, 2(8), 472; https://doi.org/10.3390/ICEM18-05365

PCB Tests during Assembly and Splitting

Dynamic Testing Laboratory, Výzkumný a zkušební ústav Plzeň s.r.o., Tylova 1581/46, 301 00 Plzeň, Czech Republic
Presented at the 18th International Conference on Experimental Mechanics (ICEM18), Brussels, Belgium, 1–5 July 2018.
Published: 18 June 2018
PDF [1863 KB, uploaded 27 June 2018]

Abstract

The flexure inspection of printed circuit boards during assembly and operation is the object of the article. The goal is to identify high stresses which can lead to destruct especially the soldered connections during final product operation using strain gauge technique. This is demonstrated on some examples. It is shown how important is the proper wires installation leading from strain gauges to measurement unit. The tests are performed according IPC guidelines but some remarks are given to guidelines specification.
Keywords: printed circuit board; strain gauge test; PCB; PCB assembly; PCB splitting printed circuit board; strain gauge test; PCB; PCB assembly; PCB splitting
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
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Chvojan, J. PCB Tests during Assembly and Splitting. Proceedings 2018, 2, 472.

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