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Proceedings 2017, 1(4), 631; doi:10.3390/proceedings1040631

Surface Integrated Printed Interdigital Structure for Process Monitoring the Curing of an Adhesive Joint

Institute for Microsensors, -Actuators and -Systems (IMSAS), Microsystems Center Bremen (MCB), University of Bremen, Bremen, Germany
Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
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Published: 11 August 2017
Download PDF [413 KB, uploaded 6 September 2017]

Abstract

We present a printable interdigital structure, integrated into the surface of a component, to monitor the curing of two adhesively joint components during the fabrication process. In the factory of the future there is a need of new sensor concepts beside the information technological infrastructure. Monitoring of the fabrication enables automated control of the process which improves the quality of adhesive joints. In addition, the cost can be reduced by individually adapted curing times. We demonstrate that cure monitoring with the printed interdigital structure is possible. Two adhesives, a fast and a slow curing one, are analyzed to show the high potential of this process monitoring method.
Keywords: printed sensor; interdigital structure; cure monitoring; impedance spectroscopy; factory of the future printed sensor; interdigital structure; cure monitoring; impedance spectroscopy; factory of the future
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Hübner, M.; Lang, W.; Dumstorff, G. Surface Integrated Printed Interdigital Structure for Process Monitoring the Curing of an Adhesive Joint. Proceedings 2017, 1, 631.

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