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Proceedings 2017, 1(4), 612; doi:10.3390/proceedings1040612

Screen-Printed Interdigital Structure on Flexible RTM6 Substrate

1
Friedrich-Wilhelm-Bessel-Institut Forschungsges. m.b.H., Bremen, Germany
2
Institute for Micro-Sensors, -Actuators and -Systems (IMSAS), Bremen, Germany
Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
*
Author to whom correspondence should be addressed.
Published: 16 August 2017
(This article belongs to the Proceedings of Eurosensors 2017)
Download PDF [677 KB, uploaded 16 August 2017]

Abstract

Ideally, for non-invasive sensor integration in fiber reinforced composites, sensors should be made of resin or fibers. For the first time, the curing degree of RTM6 resin in Glass Fiber Reinforced Polymer (GFRP) is measured with a sensor made of the identical resin that reinforces the fibers. Resin Transfer Molding type RTM6 is mixed with a plasticizer to get a thin and flexible substrate. Interdigital Capacitive (IDC) sensor is screen-printed using silver filled epoxy on the flexible RTM6 substrate. The sensor is integrated into GFRP and the curing of the RTM6 resin in glass fiber reinforced polymer composite is measured successfully.
Keywords: interdigital structure; screen-printing; RTM6; Glass Fiber Reinforced Polymer (GFRP) interdigital structure; screen-printing; RTM6; Glass Fiber Reinforced Polymer (GFRP)
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Moghaddam, M.K.; Hübner, M.; Lang, W. Screen-Printed Interdigital Structure on Flexible RTM6 Substrate. Proceedings 2017, 1, 612.

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