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Proceedings 2017, 1(4), 364; doi:10.3390/proceedings1040364

A Piezoelectric Micromachined Ultrasound Transducers (pMUT) Array, for Wide Bandwidth Underwater Communication Applications

1
ESAT-MICAS/KU Leuven, B-3001 Heverlee, Belgium
2
Institute for Materials Research (IMO), Hasselt University, Wetenschapspark 1, B-3590 Diepenbeek, Belgium
3
IMOMEC, IMEC vzw, Wetenschapspark 1, B-3590 Diepenbeek, Belgium
Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
*
Author to whom correspondence should be addressed.
Published: 7 August 2017
(This article belongs to the Proceedings of Eurosensors 2017)
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Abstract

This paper presents an array of five aluminum nitride (AlN) based piezoelectric micromachined ultrasound transducers (pMUTs) with different dimensions operating at 540–2360 kHz in air. Due to the damping effect of water or oil on the vibration of each individual pMUT, their frequency response tends to merge and significantly increases the bandwidth of the pMUTs array. The device is fabricated based on the deep reactive ion etching (DRIE) process on the backside of an SOI wafer to realize the circular diaphragms. Theoretical calculations, measured frequency response, simulation results, and detail of the fabrication are explained in this paper.
Keywords: aluminum nitride (AlN); piezoelectric micromachined ultrasound transducer (pMUT); deep reactive ion etching (DRIE); laser doppler vibrometer (LDV); X-ray diffractometer (XRD) aluminum nitride (AlN); piezoelectric micromachined ultrasound transducer (pMUT); deep reactive ion etching (DRIE); laser doppler vibrometer (LDV); X-ray diffractometer (XRD)
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Sadeghpour, S.; Pobedinskas, P.; Haenen, K.; Puers, R. A Piezoelectric Micromachined Ultrasound Transducers (pMUT) Array, for Wide Bandwidth Underwater Communication Applications. Proceedings 2017, 1, 364.

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