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Proceedings 2017, 1(4), 280; doi:10.3390/proceedings1040280

Geometrical Optimisation of Diode-Based Calorimetric Thermal Flow Sensors through Multiphysics Finite Element Modelling

1
Engineering Department, University of Cambridge, Cambridge CB2 1TN, UK
2
Flusso Ltd., Cambridge CB21 5XE, UK
Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
*
Author to whom correspondence should be addressed.
Published: 11 August 2017
Download PDF [1398 KB, uploaded 11 October 2017]

Abstract

For the first time, 3D multiphysics finite element modelling has been used to optimise the geometry of a calorimetric thermal flow sensor. The model involves and couples three physics domains: electric, thermal and fluid mechanics. The model is validated against experimental data obtained from a thermoelectronic flow sensor comprising of a tungsten heating resistor and temperature sensing diodes. Upstream and downstream diodes measure the temperature change caused by the asymmetric thermal profile when gas flow is introduced. The optimum distance between the diodes and the heater is shown along with the advantages of altering heater and membrane geometries, providing the knowledge for application-driven sensor optimisation.
Keywords: MEMS; CMOS; simulation; wall shear stress; optimisation; flow sensor MEMS; CMOS; simulation; wall shear stress; optimisation; flow sensor
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Gardner, E.L.; Luca, A.D.; Falco, C.; Udrea, F. Geometrical Optimisation of Diode-Based Calorimetric Thermal Flow Sensors through Multiphysics Finite Element Modelling. Proceedings 2017, 1, 280.

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