Droplet-Assisted Laser Direct Nanoscale Writing on Silicon†
AbstractNano-structuring using laser direct writing technology has shown great potential for industrial applications. A novel application of water droplets to this technology is proposed in this paper. With a hydrophobic layer and a controlled substrate temperature, a layer of randomly distributed water droplets with a high contact angle is formed on the substrate. These liquid droplets can be used as lenses to enhance the laser intensity at the bottom of the droplets. As a result, nanoscale holes can be fabricated on the substrate by controlling the laser energy density. We successfully fabricated holes with a diameter of 600 nm at a substrate temperature of 12 ∘C and a power density of 1.2 × 108 W/cm2 in our experiments. We also found that the hole diameter was around a ninth of the water droplet diameter. Meanwhile, the machined holes are not affected much by the focal length of the lens, but a hole with less than 100 nm in diameter at the center was observed. View Full-Text
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Chang, Y.-J.; Chang, C.-H.; Ho, C.-C.; Hsu, J.-C.; Kuo, C.-L. Droplet-Assisted Laser Direct Nanoscale Writing on Silicon. Technologies 2016, 4, 8.
Chang Y-J, Chang C-H, Ho C-C, Hsu J-C, Kuo C-L. Droplet-Assisted Laser Direct Nanoscale Writing on Silicon. Technologies. 2016; 4(1):8.Chicago/Turabian Style
Chang, Yuan-Jen; Chang, Chao-Hsuan; Ho, Chao-Ching; Hsu, Jin-Chen; Kuo, Chia-Lung. 2016. "Droplet-Assisted Laser Direct Nanoscale Writing on Silicon." Technologies 4, no. 1: 8.
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