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Journal: Coatings, 2021
Volume: 11
Number: 1298

Article: Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC
Authors: by Zhou Jiang, Kui Wen, Chen Song, Taikai Liu, Yong Dong, Min Liu, Changguang Deng, Chunming Deng and Chenghao Yang
Link: https://www.mdpi.com/2079-6412/11/11/1298

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