Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
AbstractDedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved. View Full-Text
Scifeed alert for new publicationsNever miss any articles matching your research from any publisher
- Get alerts for new papers matching your research
- Find out the new papers from selected authors
- Updated daily for 49'000+ journals and 6000+ publishers
- Define your Scifeed now
Carroll, L.; Lee, J.-S.; Scarcella, C.; Gradkowski, K.; Duperron, M.; Lu, H.; Zhao, Y.; Eason, C.; Morrissey, P.; Rensing, M.; Collins, S.; Hwang, H.Y.; O’Brien, P. Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices. Appl. Sci. 2016, 6, 426.
Carroll L, Lee J-S, Scarcella C, Gradkowski K, Duperron M, Lu H, Zhao Y, Eason C, Morrissey P, Rensing M, Collins S, Hwang HY, O’Brien P. Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices. Applied Sciences. 2016; 6(12):426.Chicago/Turabian Style
Carroll, Lee; Lee, Jun-Su; Scarcella, Carmelo; Gradkowski, Kamil; Duperron, Matthieu; Lu, Huihui; Zhao, Yan; Eason, Cormac; Morrissey, Padraic; Rensing, Marc; Collins, Sean; Hwang, How Y.; O’Brien, Peter. 2016. "Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices." Appl. Sci. 6, no. 12: 426.
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.