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Appl. Sci. 2016, 6(12), 426; doi:10.3390/app6120426

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

Photonic Packaging Group, Tyndall National Institute, Lee Maltings Complex, Cork T12R5CP, Ireland
Author to whom correspondence should be addressed.
Academic Editor: Paolo Minzioni
Received: 7 November 2016 / Revised: 1 December 2016 / Accepted: 5 December 2016 / Published: 15 December 2016
(This article belongs to the Special Issue Silicon Photonics Components and Applications)
View Full-Text   |   Download PDF [14310 KB, uploaded 15 December 2016]   |  


Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved. View Full-Text
Keywords: photonics packaging; silicon photonics; integrated optics; optoelectronics; photonic integrated circuits (PICs) photonics packaging; silicon photonics; integrated optics; optoelectronics; photonic integrated circuits (PICs)

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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Carroll, L.; Lee, J.-S.; Scarcella, C.; Gradkowski, K.; Duperron, M.; Lu, H.; Zhao, Y.; Eason, C.; Morrissey, P.; Rensing, M.; Collins, S.; Hwang, H.Y.; O’Brien, P. Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices. Appl. Sci. 2016, 6, 426.

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