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Appl. Sci. 2015, 5(3), 294-306; doi:10.3390/app5030294

Electrohydrodynamic Nanofluid Hydrothermal Treatment in an Enclosure with Sinusoidal Upper Wall

Department of Mechanical Engineering, Babol University of Technology, Babol 47144, Iran
Department of Mathematics & Statistics, FBAS, IIUI, H-10 Sector, Islamabad 44000, Pakistan
Department of Mechanical Engineering, University of California Riverside, Riverside, CA 92521, USA
Author to whom correspondence should be addressed.
Academic Editor: Takayoshi Kobayashi
Received: 8 July 2015 / Revised: 27 July 2015 / Accepted: 28 July 2015 / Published: 7 August 2015
(This article belongs to the Section Nanotechnology and Applied Nanosciences)
View Full-Text   |   Download PDF [2054 KB, uploaded 7 August 2015]   |  


The influence of non-uniform electric filed on Fe3O4-Ethylene glycol nanofluid hydrothermal treatment in an enclosure with sinusoidal upper and moving lower walls is investigated in this study. Control Volume based Finite Element Method (CVFEM) is utilized to simulate in the presented model. Numerical investigation are conducted for the sundry parameters such as Reynolds number; nanoparticle volume fraction and supplied. Results show that supplied voltage can change the flow shape. Coulomb force causes isotherms denser near the moving wall. Heat transfer rises with augment of supplied voltage and Reynolds number. Effect of electric filed on heat transfer is more pronounced at low Reynolds number. Finally, a comparison with the existing literature is also made. View Full-Text
Keywords: nanofluid; electric filed; Joule heating; CVFEM; sinusoidal wall nanofluid; electric filed; Joule heating; CVFEM; sinusoidal wall

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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Sheikholeslami, M.; Ellahi, R. Electrohydrodynamic Nanofluid Hydrothermal Treatment in an Enclosure with Sinusoidal Upper Wall. Appl. Sci. 2015, 5, 294-306.

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