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Journal: Metals, 2018
Volume: 8
Number: 887

Article: Behavior of Waste Printed Circuit Board (WPCB) Materials in the Copper Matte Smelting Process
Authors: by Xingbang Wan, Jani Fellman, Ari Jokilaakso, Lassi Klemettinen and Miikka Marjakoski
Link: https://www.mdpi.com/2075-4701/8/11/887

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