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Metals 2016, 6(5), 109; doi:10.3390/met6050109

Effects of Reflow Time on the Interfacial Microstructure and Shear Behavior of the SAC/FeNi-Cu Joint

1
School of Mechanical and Electrical Engineering, Shanghai Dianji University, Shanghai 201306, China
2
School of Material and Science Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China
*
Author to whom correspondence should be addressed.
Academic Editor: Giuseppe Casalino
Received: 21 March 2016 / Revised: 26 April 2016 / Accepted: 28 April 2016 / Published: 11 May 2016
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Abstract

Effects of reflow time on the interfacial microstructure and shear strength of the SAC/FeNi-Cu connections were investigated. It was found that the amount of Cu6Sn5 within the solder did not have a noticeable increase after a long time period of reflowing, indicating that the electro-deposited FeNi layer blocked the Cu atoms effectively into the solder area during a long period under liquid-conditions. The ball shear test results showed that the SAC/FeNi-Cu joint had a comparable strength to the SAC/Cu joint after reflowing, and the strength drop after reflowing for 210 s was less than that of the SAC/Cu joint. View Full-Text
Keywords: FeNi; UBM; IMCs FeNi; UBM; IMCs
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Chen, Y.; Wu, X.; Wang, X.; Huang, H. Effects of Reflow Time on the Interfacial Microstructure and Shear Behavior of the SAC/FeNi-Cu Joint. Metals 2016, 6, 109.

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