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Metals 2016, 6(4), 74; doi:10.3390/met6040074

Preparation of Property-Controlled Bi-Based Solder Powders by a Ball-Milling Process

1
School of Materials Science and Engineering, Pusan National University, Busan 46241, Korea
2
Powder Technology Department, Korea Institute of Materials Science, Changwon 51508, Korea
3
Deparment of Printed Electronics, Korea Institute of Machinery and Materials, Daejeon 34103, Korea
*
Author to whom correspondence should be addressed.
Academic Editor: Hugo F. Lopez
Received: 28 January 2016 / Revised: 23 February 2016 / Accepted: 4 March 2016 / Published: 25 March 2016
(This article belongs to the Special Issue Oxidation of Metals)
View Full-Text   |   Download PDF [2899 KB, uploaded 25 March 2016]   |  

Abstract

Three kinds of Bi-based solder powders with different chemical compositions of binary Bi–Sn, ternary Bi–Sn–In, and quaternary Bi–Sn–In–Ga were prepared using a gas atomization process and subsequently ball-milled for smaller-size fabrication. In particular, only the quaternary Bi–Sn–In–Ga solder powders were severely broken to the size of less than 10 μm in a polyhedral shape due to the presence of the constitutional element, the degree of overall oxidation, and the formation of solid solution, which had affected the fractured extent of the Ga-containing solder powders. Furthermore, a melting point also decreased by the addition of In and/or Ga into the binary Bi–Sn solder system, resulting in a melting point of 60.3 °C for the Bi–Sn–In–Ga solder powders. Thus, it was possible that fractured Bi–Sn–In–Ga solder powders were appropriate for the adhesion of more compact solder bump arrays, enabling reflowing at the low temperature of 110 °C on a flexible polyethylene terephthalate (PET) substrate. View Full-Text
Keywords: Ga-containing solder; ball milling; PET (polyethylene terephthalate) substrate; solder bump; solid solution Ga-containing solder; ball milling; PET (polyethylene terephthalate) substrate; solder bump; solid solution
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MDPI and ACS Style

Kim, S.H.; Son, M.J.; Nguyen, V.L.; Lim, T.-S.; Yang, D.-Y.; Kim, M.-H.; Kim, K.B.; Kim, Y.J.; Lee, J.H.; Kim, Y.D.; Kim, I.; Lee, T.-M.; Kim, Y.-J.; Yang, S. Preparation of Property-Controlled Bi-Based Solder Powders by a Ball-Milling Process. Metals 2016, 6, 74.

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