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Metals 2011, 1(1), 65-78; doi:10.3390/met1010065
Article

Particle Based Alloying by Accumulative Roll Bonding in the System Al-Cu

* ,
,
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Department of Materials Science and Engineering, Institute I: General Material Properties, Friedrich-Alexander-Universität Erlangen-Nürnberg, Martensstr. 5, Erlangen 91058, Germany
* Author to whom correspondence should be addressed.
Received: 29 September 2011 / Revised: 11 October 2011 / Accepted: 31 October 2011 / Published: 7 November 2011
(This article belongs to the Special Issue Processing and Properties of Bulk Nanostructured Materials)
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Abstract

The formation of alloys by particle reinforcement during accumulative roll bonding (ARB), and subsequent annealing, is introduced on the basis of the binary alloy system Al-Cu, where strength and electrical conductivity are examined in different microstructural states. An ultimate tensile strength (UTS) of 430 MPa for Al with 1.4 vol.% Cu was reached after three ARB cycles, which almost equals UTS of the commercially available Al-Cu alloy AA2017A with a similar copper content. Regarding electrical conductivity, the UFG structure had no significant influence. Alloying of aluminum with copper leads to a linear decrease in conductivity of 0.78 µΩ∙cm/at.% following the Nordheim rule. On the copper-rich side, alloying with aluminum leads to a slight strengthening, but drastically reduces conductivity. A linear decrease of electrical conductivity of 1.19 µΩ∙cm/at.% was obtained.
Keywords: accumulative roll bonding (ARB); particle reinforcement; ultrafine-grained microstructure; alloying; strength; electrical conductivity accumulative roll bonding (ARB); particle reinforcement; ultrafine-grained microstructure; alloying; strength; electrical conductivity
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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MDPI and ACS Style

Schmidt, C.W.; Knödler, P.; Höppel, H.W.; Göken, M. Particle Based Alloying by Accumulative Roll Bonding in the System Al-Cu. Metals 2011, 1, 65-78.

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