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Particle Based Alloying by Accumulative Roll Bonding in the System Al-Cu
Department of Materials Science and Engineering, Institute I: General Material Properties, Friedrich-Alexander-Universität Erlangen-Nürnberg, Martensstr. 5, Erlangen 91058, Germany
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Received: 29 September 2011; in revised form: 11 October 2011 / Accepted: 31 October 2011 / Published: 7 November 2011
Abstract: The formation of alloys by particle reinforcement during accumulative roll bonding (ARB), and subsequent annealing, is introduced on the basis of the binary alloy system Al-Cu, where strength and electrical conductivity are examined in different microstructural states. An ultimate tensile strength (UTS) of 430 MPa for Al with 1.4 vol.% Cu was reached after three ARB cycles, which almost equals UTS of the commercially available Al-Cu alloy AA2017A with a similar copper content. Regarding electrical conductivity, the UFG structure had no significant influence. Alloying of aluminum with copper leads to a linear decrease in conductivity of 0.78 µΩ∙cm/at.% following the Nordheim rule. On the copper-rich side, alloying with aluminum leads to a slight strengthening, but drastically reduces conductivity. A linear decrease of electrical conductivity of 1.19 µΩ∙cm/at.% was obtained.
Keywords: accumulative roll bonding (ARB); particle reinforcement; ultrafine-grained microstructure; alloying; strength; electrical conductivity
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MDPI and ACS Style
Schmidt, C.W.; Knödler, P.; Höppel, H.W.; Göken, M. Particle Based Alloying by Accumulative Roll Bonding in the System Al-Cu. Metals 2011, 1, 65-78.
Schmidt CW, Knödler P, Höppel HW, Göken M. Particle Based Alloying by Accumulative Roll Bonding in the System Al-Cu. Metals. 2011; 1(1):65-78.
Schmidt, Christian W.; Knödler, Patrick; Höppel, Heinz Werner; Göken, Mathias. 2011. "Particle Based Alloying by Accumulative Roll Bonding in the System Al-Cu." Metals 1, no. 1: 65-78.