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Polymers 2017, 9(7), 246; doi:10.3390/polym9070246

Photodeprotectable N-Alkoxybenzyl Aromatic Polyamides

1
Photosensitive Material R&D Department, Hitachi Chemical Co. Ltd., 4-13-1 Hitachi, Ibaraki 317-8555, Japan
2
Department of Materials and Life Chemistry, Kanagawa University, Rokkakubashi, Kanagawa-ku, Yokohama 221-8686, Japan
*
Authors to whom correspondence should be addressed.
Received: 22 May 2017 / Revised: 18 June 2017 / Accepted: 21 June 2017 / Published: 24 June 2017
(This article belongs to the Special Issue Functionally Responsive Polymeric Materials)
View Full-Text   |   Download PDF [3554 KB, uploaded 26 June 2017]   |  

Abstract

N-alkoxybenzyl aromatic polyamides were synthesized by polycondensation of N-alkoxybenzyl aromatic diamine with equimolar dicarboxylic acid chloride in the presence of 2.2 equiv. of pyridine at room temperature for 2 days. The obtained polyamides were mainly cyclic polymers, as determined by means of matrix-assisted laser desorption ionization time-of-flight (MALDI-TOF) mass spectrometry, and showed higher solubility in organic solvents than unprotected aromatic polyamides. Photodeprotection of N-alkoxybenzyl aromatic polyamide film containing photo acid generator (PAG) proceeded well under UV irradiation (5 J/cm2), followed by heating at 130 °C for 15 min. The nature of the polymer end groups of N-alkoxybenzyl aromatic polyamides was found to be crucial for photodeprotection reactivity. These polymers are promising candidates for photosensitive heat-resistant materials for fine Cu wiring formation by electroless Cu plating of high-density semiconductor packaging substrates. View Full-Text
Keywords: N-protected polyamide; polycondensation; photo acid generator; photodeprotection N-protected polyamide; polycondensation; photo acid generator; photodeprotection
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Iwashita, K.; Katoh, H.; Ohta, Y.; Yokozawa, T. Photodeprotectable N-Alkoxybenzyl Aromatic Polyamides. Polymers 2017, 9, 246.

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