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Polymers 2017, 9(12), 664; https://doi.org/10.3390/polym9120664

Design Analysis of Adhesively Bonded Structures

1,2,* and 3,4
1
Sino-Singapore International Joint Research Institute, Guangzhou 510550, China
2
Energy Research Institute, Nanyang Technological University, Nanyang 639798, Singapore
3
Microtechnology and Nanoscience, Chalmers University of Technology, Gothenburg Se41296, Sweden
4
SMIT Center, Shanghai University, No 20, Chengzhong Road, Shanghai 201800, China
*
Author to whom correspondence should be addressed.
Received: 23 October 2017 / Revised: 22 November 2017 / Accepted: 27 November 2017 / Published: 1 December 2017
(This article belongs to the Collection Polymeric Adhesives)
View Full-Text   |   Download PDF [1013 KB, uploaded 5 December 2017]   |  

Abstract

The existing analytical solutions for the peeling and shearing stresses in polymeric adhesively bonded structures are either too inaccurate or too complex for adoption by practicing engineers. This manuscript presents a closed-form solution that is reasonably accurate yet simple and concise enough to be adopted by practicing engineers for design analysis and exploration. Analysis of these concise solutions have yielded insightful design guidelines: (i) the magnitude of peeling stress is generally higher than that of shearing stress; (ii) the peeling stress in a balanced structure may be reduced most effectively by reducing the elastic modulus of the adherends or by increasing the adhesive-to-adherend thickness ratio and less effectively by reducing the elastic modulus of the adhesive; and (iii) the peeling stress in an unbalanced structure may be reduced by increasing the in-plane compliance of the structure, which may be implemented most effectively by reducing the thicknesses of the adherends and less effectively by reducing the elastic modulus of the adherends. View Full-Text
Keywords: balanced structures; unbalanced structures; single lap joint; closed-form solutions balanced structures; unbalanced structures; single lap joint; closed-form solutions
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
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Wong, E.-H.; Liu, J. Design Analysis of Adhesively Bonded Structures. Polymers 2017, 9, 664.

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