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Polymers 2018, 10(8), 886; https://doi.org/10.3390/polym10080886

Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module

1
School of Mechanical Engineering & Automation, Beihang University, Beijing 100191, China
2
State Key Laboratory of Tribology and Institute of Manufacturing Engineering, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
3
Beijing Key Lab of Precision/Ultra-Precision Manufacturing Equipment and Control, Tsinghua University, Beijing 100084, China
4
National Engineering Laboratory of Additive Manufacturing for Large Metallic Components, Beihang University, Beijing 100191, China
5
Hefei Innovation Research Institute of Beihang University, Hefei 230013, China
6
School of Mechanical Engineering, Shandong University of Technology, Zibo 255000, China
*
Author to whom correspondence should be addressed.
Received: 13 June 2018 / Revised: 23 July 2018 / Accepted: 28 July 2018 / Published: 8 August 2018
(This article belongs to the Special Issue Surface Modification and Functional Coatings for Polymers)
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Abstract

Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was investigated by temperature evolution of a heat sink under natural convection by infrared (IR) camera, and results showed that the heat dissipation enhancement could be up to 25%. Moreover, the heat dissipation performance of a typical heat sink in terms of light-emitting diode (LED) hip was investigated via both thermal transient measurement and the finite element analysis (FEA). The maximum LED chip temperature of the laser-textured heat sink was approximately 22.4% lower than that of the as-received heat sink. We propose that these properties accompanied with the simplicity of fabrication make laser surface texturing a promising candidate for on-chip thermal management applications in electronics. View Full-Text
Keywords: laser surface texturing; heat dissipation; heat sink; LED chip; flexible electronics laser surface texturing; heat dissipation; heat sink; LED chip; flexible electronics
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
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Lu, L.; Zhang, Z.; Guan, Y.; Zheng, H. Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module. Polymers 2018, 10, 886.

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