Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module
AbstractOptimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was investigated by temperature evolution of a heat sink under natural convection by infrared (IR) camera, and results showed that the heat dissipation enhancement could be up to 25%. Moreover, the heat dissipation performance of a typical heat sink in terms of light-emitting diode (LED) hip was investigated via both thermal transient measurement and the finite element analysis (FEA). The maximum LED chip temperature of the laser-textured heat sink was approximately 22.4% lower than that of the as-received heat sink. We propose that these properties accompanied with the simplicity of fabrication make laser surface texturing a promising candidate for on-chip thermal management applications in electronics. View Full-Text
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Lu, L.; Zhang, Z.; Guan, Y.; Zheng, H. Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module. Polymers 2018, 10, 886.
Lu L, Zhang Z, Guan Y, Zheng H. Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module. Polymers. 2018; 10(8):886.Chicago/Turabian Style
Lu, Libin; Zhang, Zhen; Guan, Yingchun; Zheng, Hongyu. 2018. "Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module." Polymers 10, no. 8: 886.
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