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Polymers 2018, 10(1), 27; doi:10.3390/polym10010027

High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides

Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan
Zhen Ding Technology Holding Limited, Taoyuan 33754, Taiwan
Department of Cosmeceutics, China Medical University, Taichung 404, Taiwan
Author to whom correspondence should be addressed.
Received: 27 November 2017 / Revised: 12 December 2017 / Accepted: 19 December 2017 / Published: 25 December 2017
(This article belongs to the Special Issue High Performance Polymers)
View Full-Text   |   Download PDF [5194 KB, uploaded 26 December 2017]   |  


Three methacrylate-containing polyimides (Px–MMA; x = 1–3) were prepared from the esterification of hydroxyl-containing polyimides (Px–OH; x = 1–3) with methacrylic anhydride. Px–MMA exhibits active ester linkages (Ph–O–C(=O)–) that can react with epoxy in the presence of 4-dimethylaminopyridine (DMAP), so Px–MMA acted as a curing agent for a dicyclopentadiene-phenol epoxy (HP7200) to prepare epoxy thermosets (Px–MMA/HP7200; x = 1–3) thermosets. For property comparisons, P1–OH/HP7200 thermosets were also prepared. The reaction between active ester and epoxy results in an ester linkage, which is less polar than secondary alcohol resulting from the reaction between phenolic OH and epoxy, so P1–MMA/HP7200 are more hydrophobic and exhibit better dielectric properties than P1–OH/HP7200. The double bond of methacrylate can cure at higher temperatures, leading to epoxy thermosets with a high-Tg and moderate-to-low dielectric properties. View Full-Text
Keywords: epoxy; methacrylate; polyimide; low-dielectric; thermoset epoxy; methacrylate; polyimide; low-dielectric; thermoset

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Chen, C.-H.; Lee, K.-W.; Lin, C.-H.; Ho, M.-J.; Hsu, M.-F.; Hsiang, S.-J.; Huang, N.-K.; Juang, T.-Y. High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides. Polymers 2018, 10, 27.

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