Next Article in Journal
Thermomechanical Behavior of Polymer Composites Based on Edge-Selectively Functionalized Graphene Nanosheets
Previous Article in Journal
Highly Productive Synthesis, Characterization, and Fluorescence and Heavy Metal Ion Adsorption Properties of Poly(2,5-dimercapto-1,3,4-thiadiazole) Nanosheets
Previous Article in Special Issue
The Preparations and Water Vapor Barrier Properties of Polyimide Films Containing Amide Moieties
Article Menu
Issue 1 (January) cover image

Export Article

Open AccessArticle
Polymers 2018, 10(1), 27; https://doi.org/10.3390/polym10010027

High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides

1
Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan
2
Zhen Ding Technology Holding Limited, Taoyuan 33754, Taiwan
3
Department of Cosmeceutics, China Medical University, Taichung 404, Taiwan
*
Author to whom correspondence should be addressed.
Received: 27 November 2017 / Revised: 12 December 2017 / Accepted: 19 December 2017 / Published: 25 December 2017
(This article belongs to the Special Issue High Performance Polymers)
Full-Text   |   PDF [5194 KB, uploaded 26 December 2017]   |  

Abstract

Three methacrylate-containing polyimides (Px–MMA; x = 1–3) were prepared from the esterification of hydroxyl-containing polyimides (Px–OH; x = 1–3) with methacrylic anhydride. Px–MMA exhibits active ester linkages (Ph–O–C(=O)–) that can react with epoxy in the presence of 4-dimethylaminopyridine (DMAP), so Px–MMA acted as a curing agent for a dicyclopentadiene-phenol epoxy (HP7200) to prepare epoxy thermosets (Px–MMA/HP7200; x = 1–3) thermosets. For property comparisons, P1–OH/HP7200 thermosets were also prepared. The reaction between active ester and epoxy results in an ester linkage, which is less polar than secondary alcohol resulting from the reaction between phenolic OH and epoxy, so P1–MMA/HP7200 are more hydrophobic and exhibit better dielectric properties than P1–OH/HP7200. The double bond of methacrylate can cure at higher temperatures, leading to epoxy thermosets with a high-Tg and moderate-to-low dielectric properties. View Full-Text
Keywords: epoxy; methacrylate; polyimide; low-dielectric; thermoset epoxy; methacrylate; polyimide; low-dielectric; thermoset
Figures

Graphical abstract

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
SciFeed

Share & Cite This Article

MDPI and ACS Style

Chen, C.-H.; Lee, K.-W.; Lin, C.-H.; Ho, M.-J.; Hsu, M.-F.; Hsiang, S.-J.; Huang, N.-K.; Juang, T.-Y. High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides. Polymers 2018, 10, 27.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Polymers EISSN 2073-4360 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top