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Materials 2016, 9(12), 1011; doi:10.3390/ma9121011

Modeling of Thermal Conductivity of CVI-Densified Composites at Fiber and Bundle Level

1
School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China
2
Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi’an 710072, China
*
Author to whom correspondence should be addressed.
Academic Editor: Yong Sheng
Received: 13 October 2016 / Revised: 25 November 2016 / Accepted: 29 November 2016 / Published: 13 December 2016
(This article belongs to the Special Issue Textile Composites)
View Full-Text   |   Download PDF [3135 KB, uploaded 13 December 2016]   |  

Abstract

The evolution of the thermal conductivities of the unidirectional, 2D woven and 3D braided composites during the CVI (chemical vapor infiltration) process have been numerically studied by the finite element method. The results show that the dual-scale pores play an important role in the thermal conduction of the CVI-densified composites. According to our results, two thermal conductivity models applicable for CVI process have been developed. The sensitivity analysis demonstrates the parameter with the most influence on the CVI-densified composites’ thermal conductivity is matrix cracking’s density, followed by volume fraction of the bundle and thermal conductance of the matrix cracks, finally by micro-porosity inside the bundles and macro-porosity between the bundles. The obtained results are well consistent with the reported data, thus our models could be useful for designing the processing and performance of the CVI-densified composites. View Full-Text
Keywords: thermal conductivity; ceramic matrix composites; chemical vapor infiltration; porosity; cracking; interface thermal conductivity; ceramic matrix composites; chemical vapor infiltration; porosity; cracking; interface
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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Guan, K.; Wu, J.; Cheng, L. Modeling of Thermal Conductivity of CVI-Densified Composites at Fiber and Bundle Level. Materials 2016, 9, 1011.

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