Preparation and Characterization of Microencapsulated Phase Change Materials for Use in Building Applications
AbstractA method for preparing and characterizing microencapsulated phase change materials (MPCM) was developed. A comparison with a commercial MPCM is also presented. Both MPCM contained paraffin wax as PCM with acrylic shell. The melting temperature of the PCM was around 21 °C, suitable for building applications. The M-2 (our laboratory made sample) and Micronal® DS 5008 X (BASF) samples were characterized using SEM, DSC, nano-indentation technique, and Gas Chromatography/Mass spectrometry (GC-MS). Both samples presented a 6 μm average size and a spherical shape. Thermal energy storage (TES) capacities were 111.73 J·g−1 and 99.3 J·g−1 for M-2 and Micronal® DS 5008 X, respectively. Mechanical characterization of the samples was performed by nano-indentation technique in order to determine the elastic modulus (E), load at maximum displacement (Pm), and displacement at maximum load (hm), concluding that M-2 presented slightly better mechanical properties. Finally, an important parameter for considering use in buildings is the release of volatile organic compounds (VOC’s). This characteristic was studied at 65 °C by CG-MS. Both samples showed VOC’s emission after 10 min of heating, however peaks intensity of VOC’s generated from M-2 microcapsules showed a lower concentration than Micronal® DS 5008 X. View Full-Text
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Giro-Paloma, J.; Al-Shannaq, R.; Fernández, A.I.; Farid, M.M. Preparation and Characterization of Microencapsulated Phase Change Materials for Use in Building Applications. Materials 2016, 9, 11.
Giro-Paloma J, Al-Shannaq R, Fernández AI, Farid MM. Preparation and Characterization of Microencapsulated Phase Change Materials for Use in Building Applications. Materials. 2016; 9(1):11.Chicago/Turabian Style
Giro-Paloma, Jessica; Al-Shannaq, Refat; Fernández, Ana I.; Farid, Mohammed M. 2016. "Preparation and Characterization of Microencapsulated Phase Change Materials for Use in Building Applications." Materials 9, no. 1: 11.
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